Back Grind/Back Metal Post Fab Engineer

Job description

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies. This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing. Responsibilities: Essential Responsibilities: Support new semiconductor technology from early development phase through volume manufacturing phase, including full documentation to support ONSEMI’s process change review process. Work with a global matrixed team while driving projects and results independently. Effectively communicating with all levels of the organization, including the executive staff. Operating independently, while taking high-level objectives into account. A team player with strong listening skills who can take input and make informed decisions. Using probe, in-line test, and failure analysis data to develop and drive process improvements. Drive cost reduction through yield enhancement and process simplification. Qualifications: Required Qualifications: Demonstrated understanding of Semiconductor technology, manufacturing, new product development, device, and yield improvement. Education: BS in Engineering or Material Science, MS or PhD preferred Experience: 6-10 years or more relevant experience in semiconductor manufacturing integration and technology development. Proven experience and a deep knowledge and understanding of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL, etc. Proven experience and a deep knowledge and understanding of power semiconductors, CMOS, and BCD integration is preferred. Assembly processing and advanced module construction are positive. Proficiency in SW tools such as MS Excel, PowerPoint, Word, MS Project, and Yield analysis tools such as Excensio, Spotfire, JMP, Minitab, etc. Knowledge and proven experience with DOE, 6-sigma, Lean, models-based problem solving, 5S, 8D, SPC, DOE, FMEA Ability to influence and lead decisions on capital equipment to enhance new technology capabilities and execution. Knowledge of assembly and package interconnect processes preferred. Experience using predictive thermo-mechanical simulations is preferred. Language Fluency – Fluent in English Language, written & verbal Salary: onsemi is excited to share the base salary range for this position is $114.000 to $193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf