Silicon Photonics EPM, Data Center SoC
Apple · Austin · Posted 2026-08-18
Job description
Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs, unlocking the bandwidth, energy efficiency, and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help shape how Apple's silicon connects at the speed of light. Are you a hard-working and proactive engineering leader with a curiosity about optics, photonics, and the future of high-bandwidth silicon interconnects? We are absolutely seeking you out! Minimum Qualifications: BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience. Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management. Preferred Qualifications: MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field. Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications. Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes. Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages. Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale. Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives. Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain. Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms. History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability. Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.