IC Packaging Engineer

Job description

Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn't have imagined, and now, can't imagine living without. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do. Minimum Qualifications: Master's Degree or foreign equivalent in Mechanical Engineering or related field and 4 years of experience in the job offered or related occupation. Education and/or experience must include: Utilizing fundamental heat transfer principles and analytical equations to evaluate and optimize packaging thermal design across silicon and system levels Utilizing C++ or Python to implement conductive heat transfer models and automate thermal simulation workflows Utilizing CFD tools to analyze flow field and heat transfer in air cooled or liquid cooled systems Designing and implementing advanced cooling solution design to maximize thermal performance across product platforms Designing and improving packaging architecture to improve maximum sustaining power and thermal efficiency. Utilizing CAD tools to design, prototype, and manufacture advanced cooling components and thermal management hardware Utilizing two phase heat transfer theory to design and optimize cold plate solutions for high power applications Designing and running thermal characteristic tests to measure and validate the thermal response of products under realistic operating conditions. Utilizing fluid dynamics principles to optimize pressure drop, flow distribution and coolant flow rate in thermal systems Preferred Qualifications: N/A