Staff Hardware Systems Engineer, Watches

Job description

Drive end-to-end electrical architecture for space-constrained devices, leveraging advanced packaging technologies like System in Package (SIP) and rigid-flex to maximize density and minimize Z-height. Act as the technical linchpin, collaborating with mechanical, Radio Frequency (RF), sensors, and display teams to resolve physical layout collisions and foster architectural convergence. Lead data-driven trade-offs balancing size, performance, cost, and thermals to keep development moving while optimizing SoC integration for power and thermal efficiency. Guide New Technology Introductions (NTI) to integrate novel, market-differentiating hardware components into the final product design. Ensure design for manufacturability (DFM) by overseeing rapid prototyping and validation of early-stage systems, ensuring compact architectures can be reliably scaled for mass production. Minimum Qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience. 6 years of experience working in a consumer electronics technical environment. 3 years of experience in technical leadership. Preferred Qualifications: 10 years of consumer electronics experience, specializing in HDI design, FPC, and rigid-flex assemblies. Experience in advanced packaging (SiP, PoP, CoW) to drive system miniaturization. Experience in lifecycle management from concept and NTI through EVT/DVT to mass production. Experience in adjacent disciplines like RF, thermal, and mechanical engineering. Ability to navigate ambiguity, evaluate complex data, and make sound technical risk assessments. Exceptional communication skills, distilling complex technical trade-offs into actionable insights for cross-functional peers and leadership.