Microphone Module Engineer

Job description

At Apple, extraordinary ideas have a way of quickly becoming extraordinary products, services, and customer experiences. Sound is an essential and compelling facet of the customer experience. Apple has assembled an elite Acoustics team that enables our customers to experience music with delight, communicate with clarity, and enjoy elegant sound throughout our product line. In Apple Acoustics we work with the utmost attention to detail, directly impacting the design of products that millions of people around the world love! A key part of the mission within Apple Acoustics is to help drive microphone hardware design, validation, and problem-solving to minimize distracting audible noises and optimize sound quality across Apple product lines. We've assembled a diverse team of acoustics, mechanics, electronics, physics, and MEMS experts; accomplished listeners, and creative problem solvers. We work closely with multi-functional teams on innovative solutions to complex engineering challenges. To help take our products to the next level, we are searching for a Microphone Module Engineer to join the fight and support our ability to analyze & develop new technologies. Could this be you? Minimum Qualifications: Proven experience in advanced Finite Element Analysis (FEA) within high-volume consumer electronic products and/or modules. Direct experience with MEMS technologies is vital. ANSYS or COMSOL experience required. Deep understanding of multiphysics modeling, including linear and non-linear structural analysis, thermoviscous acoustics, electronics, RF, heat transfer, and magnetics, as applied to mobile devices. Experience characterizing and de-bugging MEMS transducers (sensors or actuators such as IMUs, pressure sensors, microphones, micro-mirrors, etc). Direct experience with electrostatic /piezoelectric transducers. Experience developing simplified models, such as lumped element models, using tools such as Spice, Matlab, Verilog, etc. to develop and validate your design concepts. Expertise designing experiments and analyzing data using tool such as JMP, Matlab, or various scripting approaches to enable analysis of the manufacturability of your designs. Working knowledge of semiconductor and MEMS materials and packaging. International travel (10-15%). Preferred Qualifications: Experience modeling MEMS-package interactions. Most of our engineers have advanced degrees Mechanical or Electrical Engineering or an equivalent field.